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Sputtering Targets

Physical vapour deposition (PVD) is a process in which a material under vacuum environment is vaporized from a solid source. The vapour is transported from its source to the substrate and undergoes condensation on the substrate to form a thin film. The thickness of the film deposited ranges from a few nanometers to a few micrometers, with typical deposition rate 1-10 nm/s.

The technology generally used for manufacturing of sputtering targets we provide is vacuum melting and hot pressed sintering. The final targets produced have characteristics of high purity, high density, low gas content and uniform internal structure. They are manufactured in various dimensions.

High-purity rectangular sputtering targets with copper bonding for physical vapor deposition
Pure metal sputtering target disc for PVD coating applications

Pure Metal Sputtering Targets

Pure metal sputtering targets are available in both planar and rotary forms. They are manufactured from a wide range of metal elements from the periodic table, offered in various dimensions and high-purity grades.
Symbol Purity Shape
Ti 2N7, 3N5, 4N, 4N5, 5N Planar, Rotary
W 3N5 Planar, Rotary
Cr 2N5, 2N7, 2N8, 3N, 3N5 Planar, Rotary, Cathode
Al 4N, 5N, 5N5, 6N Planar, Rotary, Cathode
Ni 3N, 3N5, 4N, 4N5, 5N Planar, Rotary
Cu 3N5, 4N, 4N5, 5N, 6N Planar
Co 3N5, 5N Planar
Fe 3N, 3N5, 4N Planar, Rotary
V 3N, 3N5 Planar
Zn 3N5, 4N, 5N Planar
Sn 4N, 5N Planar, Rotary
Mo 3N5 Planar, Rotary
Ta 3N5, 4N, 4N5, 5N Planar, Rotary
Symbol Purity Shape
Nb 3N, 3N5 Planar, Rotary
B 3N Planar
Bi 4N, 5N Planar
Be 2N Planar
In 4N, 5N Planar
Pb 4N Planar
Mn 3N Planar
Pd 3N5 Planar
Ru 3N5 Planar
Si 4N, 5N, 6N Planar, Rotary
Se 4N, 5N Planar
Zr 2N4, 3N5 Planar, Rotary
Ge 5N, 6N Planar

Contact us for other details and dimensions.

Alloy Sputtering Targets

We provide sputtering targets of various alloys in high purity, planar or rotary and in various dimensions. Customized production is the matter of course.

Symbol Purity Shape
AlTi2N8, 3NPlanar
AlCr2N8, 3NPlanar
AlSi4N, 5NPlanar
AlSc3N, 4NPlanar
AlCu4N, 5NPlanar
AlNd3N, 4NPlanar
CeGd3NPlanar
CoTaZr3N, 3N5Planar
CoFeB3NPlanar
CoCr3N, 3N5Planar
Symbol Purity Shape
Cu+Ni+Ti3N, 4NPlanar
Cu+Ni3N, 3N5, 4NPlanar, Rotary
Fe+Mn3NPlanar
Fe+Cr3NPlanar
Ni+V3N, 3N5Planar
Ni+Fe3N, 3N5Planar
Ni+Cu3NPlanar
Ni+Cr2N5, 3N, 3N5 Planar
Ni+V3N, 3N5Planar
WTi3N5, 4N, 4N5Planar

Contact us for other details and dimensions.

Rare Earth Sputtering Targets

Rare earth materials have excellent magnetic, electrical and optical properties and this is the reason why sputtering targets made of them are widely used. High-tech industries like electronics, optics, semiconductor device fabrication and others are typical application fields for the usage of rare earth materials.

Symbol Purity Shape
Sc3N, 4NPlanar
Y3N, 4NPlanar
Ce3NPlanar
Dy3NPlanar
Er3NPlanar
Symbol Purity Shape
Gd3NPlanar
Ho3NPlanar
Lu3NPlanar
Nd3NPlanar
Yb3N, 4NPlanar

Contact us for other details and dimensions.

Ceramic Sputtering Targets

Available are oxide and non-oxide ceramic sputtering targets. For the fragile materials like ceramics we offer indium bonding and elastomer bonding on copper backing plate. We highly recommend to order already bonded targets to avoid risk of cracking when bonding it by yourself.
Symbol Purity Shape
AZO3N5, 4NPlanar
AlN2N5Planar
Al2O34NPlanar
B4C2N5Planar
BN2N5Planar
BaTiO33NPlanar
CeO23N, 4NPlanar
HfO23N, 4NPlanar
IGZO4NPlanar
ITO4NPlanar
In2O33N, 4NPlanar
LiNbO33N5, 4NPlanar
LiCoO23NPlanar
LiMn2O43NPlanar
LiCoO23N5, 4NPlanar
MoS23NPlanar
Symbol Purity Shape
MgO3N5, 4NPlanar
MoO33NPlanar
NiO3N5, 4NPlanar
Nb2O54NPlanar
Si3N42N5Planar
SiO24N, 4N5Planar
SiO4NPlanar
SiC2N5Planar
SiO24N, 4N5Planar
TiO2, TiOx3N5, 4NPlanar, Rotary
Ta2O54NPlanar
SrTiO24NPlanar
Y2O34NPlanar
AZO-ZnO/Al2O34NPlanar
ZrO24NPlanar
ZnO3N5Planar, Rotary

Contact us for other details and dimensions.

Customized Sputtering Targets

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